The new HiTemp ETX Series of thermoelectric coolers keep imaging sensors cool in high-temperature environments... November 4, 2020 – Imaging sensors and other sensitive camera components such as FPGA's require active cooling to keep operating temperatures below their maximum limit, ensuring high-quality image resolution. Due to solar radiation and increased heat flux … [Read more...]
Techsil & Panacol Offer a New Adhesive for Filament Winding Processes
The newly developed Vitralit® UD 1405 adhesive is an innovative adhesive system for fibre and filament winding. For high efficiency, Vitralit® UD 1405 can be applied during the winding process and immediately cured with high intensity LED curing systems. This adhesive and curing system is ideal for Carbon or Glass Fibre filament winding associated with Carbon Fibre Reinforced … [Read more...]
Bergquist® Liqui-Form TLF 6000HG Thermal Gel Earns Industry Award
Irvine, California – Last week, Henkel was honored with yet another industry award for its thermal interface material (TIM) ingenuity. BERGQUIST® Liqui-Form TLF 6000HG received a Global Technology Award in recognition the material’s performance benefits and ability to enhance the reliability of 5G telecom infrastructure devices through durable, effective heat … [Read more...]
CoolIT Prevails Against Asetek, PTAB Determines No Challenged Claims Unpatentable
Key Datacenter Liquid Cooling Patent Survives Challenge Calgary, Alberta. October 12th, 2020 – CoolIT Systems, the global leader in scalable liquid cooling technology for desktop and data centers systems, announce that on August 21, 2020, under 35 U.S.C. §318, the U.S. Patent and Trademark Office's Patent Trial and Appeal Board (PTAB) issued a Final Written Decision … [Read more...]
Heat-Blocking Defects Detected Acoustically
In the landing gear control module of an aircraft, a high-voltage IGBT is about to fail. In the solder bonding one chip’s ceramic base to its heat sink are three small air bubbles—voids, in the vocabulary of electronic failures. The three voids are close together, and the largest is almost directly under a hot spot on the die. Collectively the voids have diminished … [Read more...]
- « Previous Page
- 1
- …
- 36
- 37
- 38
- 39
- 40
- …
- 482
- Next Page »
