Researchers at the Tyndall National Institute at University College Cork in Ireland have found a new way of cooling semiconductors in computers, mobiles and games consoles to improve their performance and reduce energy consumption. Most computers have thermal interface materials (TIM) to join the chip with the heat sink, with solder or a thin, film-like sheet. Solder is … [Read more...]
High Powered Infrared LED Emitter Lights to 600 Watts
Larson Electronics’ magnalight.com added several new infrared LED light emitters, including models that include 360 watts, 480 watts and 600 watts of infrared light in the 850nm or 940nm range. The infrared LED lights operate on 12/24 volts or they can be configured for high voltage applications to 277 Volts AC 50/60 Hz. Visit magnalight.com for more information. … [Read more...]
System Measures Pressure Distribution between Heat Sinks, Components
The new Tactilus® heat-sink analysis system by Sensor Products Inc. enables research and design engineers to quickly and precisely test and correct the surface contact and pressure distribution between the heat sink and its source. Even a slight warping of the heat exchange structure or reduction in surface contact area can have a profound effect on cooling efficacy. If the … [Read more...]
Compliant Elastomer Gap Filler with High Tolerance Stack-Up
Laird Technologies, Inc. recently released its new Tflex™ XS400 Series thermal gap filler, offering a compliant elastomer gap filler specifically designed to provide moderate thermal performance with a thermal conductivity of 2.0 W/mK. This soft interface pad conforms with minimal pressure, resulting in minimal thermal resistance even at low pressure with little or no stress on … [Read more...]
Purdue Moves Supercomputer to Portable Data Center
Purdue University is moving its Steele supercomputing cluster to a portable, self-contained, modular computer center. Companies such as Amazon, Google and Microsoft make significant use of quickly deployed, energy-efficient containerized data centers. But Purdue is one of the first universities to do so and to use HP’s “POD” (Performance-optimized Data Center). The … [Read more...]
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