Laird Technologies, Inc. recently released its thermal/EMI combination shield design case study, which discusses in detail the process of how thermal simulation software was utilized in the design of a thermal/EMI combination shield. Instead of building a physical prototype, the initial concept design was simulated, allowing for an accurate prediction of the thermal performance … [Read more...]
Thermal Paper Draws Top Award at PCIM Conference
A paper on thermal aspects in power systems won a Young Engineer Award at this year’s PCIM (Power Electronics/Intelligent Motion/Power Quality) Europe Conference. The Young Engineer Award is presented to exceptional contributions from young professionals (under 35 years old). Andreas Munding of Liebherr-Elektronik GmbH and his co-authors were recognized for their paper, … [Read more...]
Study: Carbon Nanotubes Could be Used for New Energy Systems
A team of scientists at Massachusetts Institute of Technology have discovered a previously unknown phenomenon that can cause powerful waves of energy to shoot through minuscule wires known as carbon nanotubes. The discovery could lead to a new way of producing electricity, the researchers say. The phenomenon, described as thermopower waves, is such a new discovery that it’s … [Read more...]
Intel® Atom™ Processor-Based Platform Uses Significantly Lower Power
Intel Corporation has unveiled its newest Intel® Atom™ processor-based platform. The technology package provides significantly lower power consumption and prepares the company to target a range of computing devices, including high-end smartphones, tablets and other mobile handheld products. The platform has been repartitioned to include the Intel Atom processor Z6xx, which … [Read more...]
ElectronicsCooling Spring 2010 Print Issue
Did you miss us? For those of you that are faithful readers of Electronics Cooling, we are pleased to inform you that after a short interval of restructuring, we have resumed publication. Given the recent downturn in the economy as a whole, and specifically within the electronics thermal management community, we can hope that this is a sign of improvement and recovery. We will … [Read more...]
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