Orion Fans has introduced a new line of vane-axial fans with superior airflow in exceptionally high static pressure environments. High performance VA Series DC fans feature a dual ball bearing system with a brushless DC, auto restart, polarity-protected motor. The OD1238 VA Series (120x38mm) offers airflows from 3.96 to 8.0 m3/min (140 to 283 cfm). The OD9238 VA Series … [Read more...]
Lowering a Notebook CPU Temperature Using a Dual-Tunnel Blower
Figure 1. Side by side comparison of blower technologies. Introduction Notebook computers on the market today may be classified in three categories. In the first category are the super slim and powerful notebooks such as the ThinkPad X300. In the second are the slim and light netbooks such as the ASUS Eee PC, and in the third are the high-end mobile workstations for … [Read more...]
LED Thermal Standardization: A Hot Topic
Introduction The main topic of the article is how to cope with the increasing need for standardization of thermal characterization of LEDs (Light Emitting Diodes) and LED-based products (see Fig.1 showing a typical LED package). The LED-business is growing much faster than analysts predicted five years ago. Unfortunately, the progress in thermal characterization has not kept … [Read more...]
Health Assessment and Prognostics of Electronic Products: An Alternative to Traditional Reliability Prediction Methods
Introduction Traditional handbook-based reliability prediction methods for electronic products include Mil-Hdbk-217, Telcordia SR-332 (formerly Bellcore), PRISM, FIDES, CNET/RDF (European), and the Chinese GJB-299. These methods rely on analysis of failure data collected from the field and assume that the components of a system have inherent constant failure rates that are … [Read more...]
Using a Matrix Inverse Method to Solve a Thermal Resistance Network
Today virtually all serious thermal analysis and design calculations for electronic packages are performed using various commercial flow and thermal conduction codes. Nonetheless, there are still many instances, especially in the early phases of a project, when the thermal engineer finds it advantageous to perform so called "back of the envelope" calculations without resorting … [Read more...]
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