Introduction As most readers of ElectronicsCooling magazine are no doubt aware, fins may be added to a heat transfer surface to increase the effective heat transfer area and thereby reduce the base surface temperature for a given heat load and heat transfer coefficient. The formula to estimate the heat dissipation capability, qf, of a straight fin is given by, and Af is … [Read more...]
Pushing the Boundaries of Heat Pipe Operation
Introduction Heat pipes are well-established two-phase devices used in the electronics cooling industry to transport heat from the point it is generated to the place where it is extracted from the system. Three wick structures are most commonly used to provide the capillary path for the liquid return to evaporation section; these are sintered powder, screen mesh and grooved … [Read more...]
Power Map Calculations Using Image Sources and Superposition
Introduction In the past, thermal engineers were content to calculate a single junction temperature in the thermal characterization of an integrated circuit chip in a package. In recent years, as power levels have increased, more attention has been paid to the calculation of local temperature variations on a chip. This is necessary to adequately account for high-heat-flux … [Read more...]
Integrated Heat Pipe Spreader for Improved FBDIMM Memory Module Thermal Management
Introduction Due to the increasing power density in today's industry standard servers, thermal design and cooling is a significant challenge. In a typical server, the two most challenging elements to cool are the processors and the memory modules. The system level fan speeds are directly dictated (in most cases) by both processor and memory temperatures. Due to the fact that … [Read more...]
Giving Back
haring, Tech nical knowledgeThe A&D group represents a large number of subscribers but their contribution rate measured against authored articles in ElectronicsCooling is underrepresented. Soliciting targeted articles from my coworkers within this industry group has proved difficult. I understand some of the reasons for the lower number of submissions but contend that there … [Read more...]
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