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Electronics Cooling

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Thermal Strain In Semiconductor Packages, Part I

 

Introduction Silicon became the semiconductor of choice for ICs because of its electrical properties, not because of its mechanical properties. In the earliest days of ICs when chips were small and power levels were low, the mechanical properties of silicon were of little consequence. However, for some time, the opposite situation has been the norm. Now, there are much larger … [Read more...]

Thermal Diffusivity

 

Thermal diffusivity is a measure of the transient thermal response of a material to a change in temperature and the term thermal diffusivity (α) is defined asα= k/(ρ x cp) where αis the thermal diffusivity (m2/sec) k is the thermal conductivity (W/m-K) ρ is the density (kg/m3) cp is the heat capacity (J/kg-K) It should be noted that each of these quantities can … [Read more...]

Thanks and Congratulations

 

Since the first issue of ElectronicsCooling magazine emerged in June 1995, I have had the privilege of publishing a number of feature articles in the magazine. Writing these articles came relatively easy because the topics addressed were on aspects of electronics cooling, such as liquid cooling, thermoelectrics and air cooling, that I have worked on throughout my 41 years in … [Read more...]

Design For Manufacturability Of Forced Convection Air Cooled Fully Ducted Heat Sinks

 

Introduction The requisite thermal management for a microprocessor is most often achieved via an aluminum heat sink (fin structure) and a small fan. The effort discussed herein deals with the development of a 'design for manufacturability' methodology for forced convection cooled, plate fin arrays used to form high performance heat sinks for electronics cooling applications. In … [Read more...]

Comparison Of Heat Transfer Rates Of Different Nanofluids On The Basis Of The Mouromtseff Number

 

Nanofluids are dispersions of nanometer-sized particles in a base fluid such as water, ethylene glycol or propylene glycol. In the last decade, nanofluids have attracted more attention as a new generation of coolants for various industrial and automotive applications. Use of high thermal conductivity metallic nanoparticles (e.g., copper, aluminum, silver, gold, etc.) … [Read more...]

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