In recent years there has been a growing interest in the application of thermoelectrics to electronics cooling. Attention has been focused on thermoelectric cooling both as a possible means to enhance module cooling and to address the chip hot spot problem. Effort has been directed towards the development of new bulk materials and thin film micro-coolers. The usefulness of … [Read more...]
Cooling Options And Challenges Of High Power Semiconductor Modules
Introduction Trends in power electronics systems and devices over the last decade have placed increasing demands on the efficiencies of the thermal management systems used for power Metal Oxide Semiconductor Field-Effect Transistor (MOSFET) and Insulated Gate Bipolar Transistor (IGBT) modules. The pressure to decrease the size of power electronics systems and, subsequently, the … [Read more...]
Thermal Conductivity of Solders
Soldering has been a primary method of establishing mechanical and electrical connections in electronics for many years and will likely be used in this fashion in the future. While there are several physical properties and characteristics of solders that are of interest to the electronics community at large, one of the most significant physical properties to a thermal engineer … [Read more...]
Solid-State Microrefrigerator on a Chip
Introduction Temperature control of microelectronic devices has become more important in recent years. Device miniaturization and higher switching speeds have increased power dissipation substantially. Limiting the maximum die temperature has resulted in an increase of packaging complexity and cost. The failure rates resulting from electromigration and oxide breakdown are … [Read more...]
So Many Chips, So Little Time; Device Temperature Prediction in Multi-Chip Packages
Introduction The same trend that has led to ever-higher levels of integration of computation and processing functions on a single chip is now driving the integration of several chips into the same package. The use of multi-chip packages (MCPs) enables miniaturization of a circuit when it is not practical to incorporate all of the desired functionality on a single chip. The … [Read more...]
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