Introduction Heat from electronic devices is an integral part of information processing, not a nuisance that can someday be eliminated. This is a physical principle that is independent of the device of information processing. However, when viewed in the historical perspective, the severity of heat problems has not monotonically increased. It came to the fore some time ago, … [Read more...]
Comparing Liquid Coolants From Both A Thermal And Hydraulic Perspective
In the May 2006 issue the Calculation Corner focused on the comparison of liquid coolants using the Mouromtseff number [1]. For single phase forced convection, Mouromtseff found this figure of merit, Mo, to follow the form where ρ, k, cp, and � represent the density, thermal conductivity, specific heat (at constant pressure) and dynamic viscosity of the fluid. The … [Read more...]
Thermal Conductivity of Doped, Porous and Isotopically Pure Silicon
Earlier issues of ElectronicsCooling showed the thermal conductivity for pure Si (May '98), SiO2 (Aug '04) and III-V semiconductors (Feb '06). This column focuses on doped Si, porous Si and isotopically pure Si. Table 1. Thermal Conductivity Data at Room Temperature The first seven rows of Table 1 show thermal conductivity data for natural and isotopically pure Si as … [Read more...]
On-Chip Electrowetting Cooling
Introduction Control of component temperatures and temperature gradients is essential for the successful operation and reliability of electronics products [1]. However, conventional cooling methods, such as natural convection or fan-induced air-cooling, cannot cope with the increasing demand for electronics cooling. Therefore, more sophisticated cooling techniques are required. … [Read more...]
Micropumping Technologies for Electronics Cooling
Introduction Traditional cooling approaches, consisting typically of external air-cooled heat sinks, are increasingly falling short in meeting the thermal management challenges of emerging electronic systems. Integrated cooling designs are being investigated to eliminate some of the interface contact resistances introduced by add-on heat sinking and to minimize package … [Read more...]
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