As the power and power density of IC components continue to rise [1], the need to effectively dissipate the heat to ensure long-term reliability has increased [2]. The largest contributor to the total thermal resistance along the heat conduction path comes from the thermal interface material (TIM) used between the surfaces of the silicon die and the heat spreader or heat sink. … [Read more...]
Comparing Heat Transfer Rates of Liquid Coolants Using the Mouromtseff Number
As many readers of ElectronicsCooling are aware, there is a growing interest in the electronics cooling community in the possible use of liquid cooling. This interest is, of course, due to the trend of increased heat loads at chip, module, and system levels of packaging. The article by Mohapatra [1] in this issue of ElectronicsCooling provides a good overview of both dielectric … [Read more...]
An Overview of Liquid Coolants for Electronics Cooling
Introduction The cooling of electronic parts has become a major challenge in recent times due to the advancements in the design of faster and smaller components. As a result, different cooling technologies have been developed to efficiently remove the heat from these components [1, 2]. The use of a liquid coolant has become attractive due to the higher heat transfer coefficient … [Read more...]
Thermal Resistance Comparison Of Graphite Foam, Aluminum, And Copper Heat Sinks
Introduction With thermal solutions becoming more challenging, there is a push for novel cooling ideas or materials to further mitigate thermal issues facing today's electronics. In these design situations, the proven method of analytical calculations, modeling, and laboratory testing is sometimes bypassed in the search for a quick "cure-all" solution. Evolutionary progress is … [Read more...]
Thermal Design And NEBS Compliance
Introduction As part of contractual and design requirements, telecom equipment destined for certain networks in the North American market has to be tested to the Network Equipment Building System (NEBS) standard and comply with its requirements. NEBS is a standard from Telcordia, formerly known as Bell Communication Research (Bellcore). Technically speaking, NEBS is the … [Read more...]
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