In the May 2006 issue the Calculation Corner focused on the comparison of liquid coolants using the Mouromtseff number [1]. For single phase forced convection, Mouromtseff found this figure of merit, Mo, to follow the form where ρ, k, cp, and � represent the density, thermal conductivity, specific heat (at constant pressure) and dynamic viscosity of the fluid. The … [Read more...]
Thermal Conductivity of Doped, Porous and Isotopically Pure Silicon
Earlier issues of ElectronicsCooling showed the thermal conductivity for pure Si (May '98), SiO2 (Aug '04) and III-V semiconductors (Feb '06). This column focuses on doped Si, porous Si and isotopically pure Si. Table 1. Thermal Conductivity Data at Room Temperature The first seven rows of Table 1 show thermal conductivity data for natural and isotopically pure Si as … [Read more...]
On-Chip Electrowetting Cooling
Introduction Control of component temperatures and temperature gradients is essential for the successful operation and reliability of electronics products [1]. However, conventional cooling methods, such as natural convection or fan-induced air-cooling, cannot cope with the increasing demand for electronics cooling. Therefore, more sophisticated cooling techniques are required. … [Read more...]
Micropumping Technologies for Electronics Cooling
Introduction Traditional cooling approaches, consisting typically of external air-cooled heat sinks, are increasingly falling short in meeting the thermal management challenges of emerging electronic systems. Integrated cooling designs are being investigated to eliminate some of the interface contact resistances introduced by add-on heat sinking and to minimize package … [Read more...]
Direct Die Attach Using a Room Temperature Soldering Process
As the power and power density of IC components continue to rise [1], the need to effectively dissipate the heat to ensure long-term reliability has increased [2]. The largest contributor to the total thermal resistance along the heat conduction path comes from the thermal interface material (TIM) used between the surfaces of the silicon die and the heat spreader or heat sink. … [Read more...]
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