Introduction Microprocessor and system thermal management are linked to facility cooling: power dissipation and cooling techniques employed at one end of the size scale have cascading impacts at the other extreme (Figure 1). For example, ineffective airflow distribution or insufficient underfloor static pressure in a data center can reduce the supply airflow rate from … [Read more...]
Low Profile Heat Sink Cooling Technologies for Next Generation CPU Thermal Designs
Introduction The electronic industry requires increased forced-air cooling limits to cool high-end server CPUs adequately. Improving air-cooled heat sink thermal performance is one of the critical areas for increasing the overall air-cooling limit. One of the challenging aspects for improving heat sink performance is the effective utilization of relatively large air-cooled fin … [Read more...]
Estimating Temperatures in an Air-cooled Closed Box Electronics Enclosure
Introduction In the majority of air-cooling applications, openings or vents are provided in the enclosure or box in which the electronic components are housed. The required cooling air is drawn in from outside the box by fans or blowers. In some applications, however, there may be airborne particulates or other substances in the air that would be injurious to the electrical … [Read more...]
ASHRAE Committee Formed to Establish Thermal Guidelines for Datacom Facilities
Introduction The environment of every data center is complex and unique. Air currents within the data center have hot and cold air streams colliding, cold air exhausting upward from perforated tiles, hot air streams exhausting from tops and the rear of servers and storage racks. Not only are these air circulation patterns extremely complex, they can also be transient in nature … [Read more...]
Use Of Heat Pipe Cooling Systems In The Electronics Industry
Introduction Thermal management of electronic components must solve problems connected with the limitations on the maximum chip temperature and with the requirements on the level of temperature uniformity. To cool electronic components, one can use air and liquid coolers as well as coolers constructed on the principle of the phase change heat transfer in closed space; i.e., … [Read more...]
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