The big electronics design show was in town. Gino suggested we blow off work for the day and check it out. I was a little short on promotional pens and key chains, so I fell in with him. Gino is OK, even if he's one of those Reliability Engineers. The cavernous convention center was packed with flashy booths of the usual component, CAD-tool and test equipment vendors. It's … [Read more...]
Modeling Heat Conduction in Printed Circuit Boards Using Finite Element Analysis
Introduction Heat transfer in and around a printed circuit board (PCB) is generally very complex. Some of the heat generated in components is conducted away through the multiple conducting (trace) layers, vias, and dielectric layers of the board; and some is dissipated by convection and radiation from the exposed surfaces. There has long been a focus on characterizing the … [Read more...]
Critical Cooling Issues in High Power Radio Frequency Transmitter Amplifiers
Introduction While emerging methodologies correctly insist that thermal engineers should be involved right from the early conceptual stages of electronics product design [1], many situations still require thermal analysis well after the introduction of the product to its intended application. Military transmitters installed in the 1980's and 1990's and still in operation today … [Read more...]
CFD Prediction of Electronic Component Operational Temperature on PCBs
Introduction The thermal design of today's electronic equipment relies significantly on the use of Computational Fluid Dynamics (CFD) software for the prediction of electronics operational temperature. In the early to intermediate product design phase, CFD analysis is used to select a cooling strategy and refine a thermal design by parametric analysis. In the final design … [Read more...]
Thermal Interface Materials: A Brief Review of Design Characteristics and Materials
Introduction In the past few decades, as microprocessors have continued to evolve along Moore's law, providing increased functionality and performance, there has been an associated increase in cooling demand driven both by the increase in raw power and in local power densities on the die, commonly referred to as "hot spots"[1, 2]. Considerable attention has therefore been given … [Read more...]
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