Introduction The thermal design of today's electronic equipment relies significantly on the use of Computational Fluid Dynamics (CFD) software for the prediction of electronics operational temperature. In the early to intermediate product design phase, CFD analysis is used to select a cooling strategy and refine a thermal design by parametric analysis. In the final design … [Read more...]
Thermal Interface Materials: A Brief Review of Design Characteristics and Materials
Introduction In the past few decades, as microprocessors have continued to evolve along Moore's law, providing increased functionality and performance, there has been an associated increase in cooling demand driven both by the increase in raw power and in local power densities on the die, commonly referred to as "hot spots"[1, 2]. Considerable attention has therefore been given … [Read more...]
The Temperature Ratings Of Electronic Parts
Introduction Semiconductor parts are most often specified for use in the "commercial" 0 to 70°C and, to a lesser extent, in the "industrial" -40 to 85°C operating temperature range. These operating temperature ratings generally satisfy the demands of the dominant semiconductor customers in the computer, telecommunications, and consumer electronic industries. There is also a … [Read more...]
The Benefits Of Using Hadiabatic In Thinking About Electronics Cooling
The heat transfer coefficient is used to describe convective heat transfer between a solid and a fluid, as in Equation (1). The heat transfer coefficient is a defined parameter, not a physical property like thermal conductivity, and different definitions are used for different situations. The preferred definition for use in the electronics-cooling situation is … [Read more...]
Estimating The Effect Of Flow Bypass On Parallel Plate-Fin Heat Sink Performance
In past issues of Electronics Cooling, methodologies were presented for estimating parallel plate-fin heat sink thermal resistance [1] and pressure drop [2]. The underlying assumption for both articles was that all the flow delivered by the fan is forced to go through the channels formed between the fins. As noted in the second article this is often not the case and much of the … [Read more...]
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