Due to the flexible manufacturing processes for producing BGA packages, there has been an explosion of new package designs, many of which contain more than one integrated circuit chip [1]. Existing industry standards for IC package thermal characterization apply only to single-chip packages. This Calculation Corner will present some techniques for calculating the junction … [Read more...]
The Thermal Conductivity of Air at Reduced Pressures and Length Scales
In several earlier issues of Electronics Cooling, I discussed the thermal conductivity of air as a function of temperature and pressure. Therein, it was stated that the temperature dependence cannot be neglected, but that the pressure dependence, under 'normal' conditions, is virtually absent. But what is 'normal' these days? In 'normal' electronic systems we, indeed, need … [Read more...]
Selective Surfaces
"Who's that guy with the gigantic novelty scissors?" I asked. "That's Percy," Herbie said, "VP of the Biological Intercommunications Group, BIG for short. The Lost Pet Tracking System has been his baby since Day One." There was a festive air at the Prairieton Police Station, kids holding dogs on leashes, colorful balloons tied to squad cars, even the high school marching … [Read more...]
Numerical Modeling and Experimental Verification of High-density Servers
High-density hardware and software are developed as part of an initiative to greatly increase data center compute densities. Concept systems presented here are based on the Intel® Itanium™ processor family and are designed for a 1U rack-mount form factor. The current dual-processor system concept is targeted at the front-end server market (e.g., web hosting and mail routing), … [Read more...]
EMC and Thermal Design Conflicts in a PC
Thermal and EMC design in high-speed digital electronics systems has become a battle of conflicting requirements. Faster switching has led to increased electromagnetic (EM) emissions due to the extended bandwidth of signals. Higher-density components are consuming more power, generating increased EM fields and more heat. Electronics equipment must comply with radiation limits … [Read more...]
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