One of the first practical lessons that electronic-circuit designer learn is to be aware of power-rail voltage drop, commonly called “IR drop,” which is the simple product of current and resistance in the printed-circuit board (PCB) track, wire, or larger cable. As currents increase to tens of amps and much higher, the IR-drop problem become more acute. Even a modest 50 mΩ of … [Read more...]
Nortek Celebrates the Completion of the First StatePoint™ Liquid Cooling System
The first StatePoint™ Liquid Cooling system, “The World’s First Sustainable Data Center Cooling Technology,” reduces energy and water consumption in data centers. Oklahoma City, Okla., Dec. 16 , 2019 — Nortek Air Solutions (NAS), St. Louis, Mo., a leading provider of custom air handlers, celebrated the completion of its first manufactured StatePoint™ Liquid Cooling (SPLC) … [Read more...]
Schneider Electric Announces Industry’s First Integrated Rack with Immersed, Liquid-Cooled IT for Data Centers
Integrated, fulfilled and supported by Avnet, this solution combines a GPU server with Iceotope’s innovative chassis-based, immersion cooling technology and Schneider Electric’s NetShelter liquid-cooled enclosure system. Marks a milestone in industrializing liquid-cooled server solutions that promise lower operating costs, higher efficiencies, smaller footprint, and fan-less … [Read more...]
Underfill Epoxy Offers Thermal Conductivity and Electrical Insulation
Product: EP29LPTCHT Release Date: 11/21/2019 Master Bond EP29LPTCHT is a two component, low viscosity epoxy compound that can be effectively utilized for underfill and encapsulation applications. It does not need excessive heat for curing and has a long working life at room temperature. This system is electrically insulative and thermally conductive with very fine particle … [Read more...]
Low Compression Force Sarcon
Carteret, NJ — The compression characteristics of thermal gap fillers should be key considerations during a product’s early design phase. For applications that have delicate components or widely varying gap distances, Fujipoly® created a line of Low Compression Force gap filler pads. These TIMs help avoid overstressing the printed circuit board (PCB) and fragile solder joints … [Read more...]
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