Computer heat sinks, such as fin arrays and heat pipes, are much larger than silicon chips and are continuing to grow in size. This trend is driven by the increasing chip heat generation rates and has serious implications for overall system performance. The large volume of existing heat sinks causes discrete memory, video, and power-delivery components to be crowded away from … [Read more...]
Electronic Information Exchange
Electronic data exchange represents a very important link for integrating PCB electrical layout, analysis and mechanical design. It has become, in fact, the basis for enhanced economic and industrial growth. The Intermediate Data Format (IDF) is the most used file format for exchanging printed circuit assembly (PCA) data between electrical and mechanical CAD/CAE systems and for … [Read more...]
Thermal joint conductance for graphite materials
The heat flow across a metal/interstitial elastic-layer/metal joint is a very important problem in many microelectronic applications. It is generally known that when two surfaces are brought together, intimate solid-to-solid contact occurs only at discrete parts of the interface. Therefore, the actual contact area of pressed surfaces represents a very small fraction of the … [Read more...]
There's something for everybody on talk radio
I was doing my Sunday morning (2 a.m.) radio call-in show about electronics cooling (Hot Air on the Air with Tony K), when I heard a familiar voice on the line. "Herbie in Hereford," I greeted the caller, "You're on the air with Hot Air." "First time caller, long time listener . . .," the caller said. "Wow. There must be an insomnia epidemic," I interrupted. Johnny, the … [Read more...]
Simplified Transient Model for IC Packages
Previous installments of this column have all dealt with situations in which the die temperature was assumed to be at a constant temperature after the system had achieved the steady state. However, there are many times in which it is useful to know how rapidly the temperature of the chip changes when the applied power changes abruptly. This month's column presents a simple … [Read more...]
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