In several earlier issues of Electronics Cooling, I discussed the thermal conductivity of air as a function of temperature and pressure. Therein, it was stated that the temperature dependence cannot be neglected, but that the pressure dependence, under 'normal' conditions, is virtually absent. But what is 'normal' these days? In 'normal' electronic systems we, indeed, need … [Read more...]
Selective Surfaces
"Who's that guy with the gigantic novelty scissors?" I asked. "That's Percy," Herbie said, "VP of the Biological Intercommunications Group, BIG for short. The Lost Pet Tracking System has been his baby since Day One." There was a festive air at the Prairieton Police Station, kids holding dogs on leashes, colorful balloons tied to squad cars, even the high school marching … [Read more...]
Numerical Modeling and Experimental Verification of High-density Servers
High-density hardware and software are developed as part of an initiative to greatly increase data center compute densities. Concept systems presented here are based on the Intel® Itanium™ processor family and are designed for a 1U rack-mount form factor. The current dual-processor system concept is targeted at the front-end server market (e.g., web hosting and mail routing), … [Read more...]
EMC and Thermal Design Conflicts in a PC
Thermal and EMC design in high-speed digital electronics systems has become a battle of conflicting requirements. Faster switching has led to increased electromagnetic (EM) emissions due to the extended bandwidth of signals. Higher-density components are consuming more power, generating increased EM fields and more heat. Electronics equipment must comply with radiation limits … [Read more...]
Electroosmotic Microchannel Cooling System for Microprocessors
Computer heat sinks, such as fin arrays and heat pipes, are much larger than silicon chips and are continuing to grow in size. This trend is driven by the increasing chip heat generation rates and has serious implications for overall system performance. The large volume of existing heat sinks causes discrete memory, video, and power-delivery components to be crowded away from … [Read more...]
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