Different forms of carbon, such as processed natural graphite, pyrolytic graphite, diamond-like carbon, and synthetic diamond, offer lots of possibilities for maximizing conductive heat transfer.Synthetic diamond has already found its place as a common solution for heat spreaders inside semiconductor laser components, where temperature stabilization is of utmost importance for … [Read more...]
Advanced Techniques for IC Surface Temperature Measurement
Introduction: The Need for IC Surface Measurement Techniques Current trends in microelectronic design generate challenges in both the design and test of integrated circuits (ICs). One area that has been gaining increased relevance with regard to the microelectronic evolution is thermal management/analysis, which proves essential in the domain of IC design to prevent reliability … [Read more...]
Thermomechanical stress modeling in microelectronics and photonics
Thermomechanical stresses and deformations are the major contributors to malfunctions of, and failures in, microelectronics and photonics devices, packages and systems. In microelectronics, the most serious consequences of the elevated thermal stresses are usually associated with mechanical (structural) failures (e.g., ductile rupture, brittle fracture, failures due to fatigue, … [Read more...]
Thermal management of highly integrated electronic packages in avionics applications
The packaging and thermal management of electronic equipment has become an important issue because of increased power levels and the simultaneous miniaturization of the devices. With the advent of denser device packaging and faster intrinsic speeds, cost, reliability and size have been improved, but, unfortunately, packaging and thermal management have not followed at the same … [Read more...]
The thermal conductivity of rubbers/elastomers
In the May 2001 issue, this column discussed the thermal conductivity of unfilled plastics. The interested reader may have noticed that the category of rubbers/elastomers was missing. This was not without reason. The user of these elastic materials should be aware that the final thermal resistance (which is, of course, from an engineering point of view, the more important … [Read more...]
- « Previous Page
- 1
- …
- 453
- 454
- 455
- 456
- 457
- …
- 482
- Next Page »
