Although most of the emphasis today in the electronics cooling community is devoted to extending forced convection cooling capability, many applications still depend upon natural convection cooling. Basically, natural convection cooling combined with radiation is what results when a fan is not used in the cooling design to move air. Instead, movement of the air is induced by … [Read more...]
Dimensional Analysis for Package Designers
The care with which we express the dimensions of important parameters makes the difference between conveying useful information or conveying useless or misleading data. Taking the issue of units one more step, the purpose of this article is to suggest that we occasionally organize our work to get rid of dimensions altogether. We must live in a dimensional world. A critical … [Read more...]
Visualization of air flows in electronics systems
The three-dimensional shape and irregular nature of electronic component topologies on air-cooled Printed Circuit Boards (PCBs) give rise to complex air flow patterns that have been well documented [1]. Even laminar flows over relatively simple shapes, such as cubical metal blocks simulating electronic components, often exhibit multi-dimensional flow phenomena that include … [Read more...]
The thermal conductivity of unfilled plastics
This time, the focus is on the thermal conductivity of unfilled plastics. There are hundreds of them, so only a small selection can be presented. From a thermal point of view, plastics are a notoriously difficult family. Different sources show large variations in the thermal conductivity, and handbooks provide a range of values for many materials instead of a single value. The … [Read more...]
The submerged double jet impingement (SDJI) method for thermal testing of packages
Over the past decades, the functionality of electronic parts has improved considerably. Increasing power requirements of semiconductor chips make it difficult to keep the temperature below the imposed limits. Thermal management of the chip is one of the main functions of the package. To fully characterize the package thermally, numerical simulations and experimental tests are … [Read more...]
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