Heat dissipation of active devices has become one of the limiting factors in further miniaturization. While component manufacturers succeed in decreasing the overall thermal resistance of their packages, the thermal interface resistance to the board becomes the next limiting factor. Therefore, understanding interface and contact resistances becomes increasingly important for … [Read more...]
Determining the junction temperature in a semiconductor package, part IV – localized heat generation on the die
In the standard thermal test environment, thermal test chips are designed to dissipate the applied power uniformly over most of the die surface. However, in many situations of practical interest, the power is dissipated over a localized area of the die. This column provides calculation methods to deal with the latter situation. Figure 1 illustrates the situation of interest … [Read more...]
Thermal challenges in the telecom and networks industry
Figure 1: Telecom Equipment Operating EnvironmentsThere are two main reasons for doing thermal design in the telecommunication industry. The first is to ensure functionality of the equipment and system when subjected to extreme environments. The second is to ensure high dependability of the network. While doing thermal design, many challenges must be kept in mind: the … [Read more...]
Temperature of in-line array of electronic components simulated by rectangular blocks
An earlier work by the authors (Molki et al., 1995) discussed the adiabatic heat transfer coefficient of rectangular blocks situated in an in-line array. In real circuit boards, heat is generated by a number of electronic components. The temperature of each component is affected by two factors, self-heating and thermal wake effect. Self-heating is the temperature rise due to … [Read more...]
Low Noise Axial Fan Applications
There are three basics to creating low-noise axial fan applications: airflow path design initial fan design analysis and correction of specific acoustical responses in the physical model Each is important and contributes to the overall sound levels of the program. Figure 1. Representative flow-versus-pressure characteristic of system air path.A flow-versus-pressure … [Read more...]
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