Figure 1. Cooling power density for different T.E. cooler designs (adaped from Vandersande and Fleurial [6]). Introduction Many advances in computer technology have been made possible by increases in the packaging density of electronics. These advances began with the introduction of the transistor in 1947 and continue today with ultra-large scale integration at the chip level … [Read more...]
A system level cooling solution for cellular phone applications
Improving thermal performance of electronic components is very challenging due to the increasing power density and decreasing module sizes. The design trade off between electrical and mechanical characteristics and the cost of manufacturing MCM products requires innovative solutions to improve device thermal performance. The primary cooling path in portable electronics serves … [Read more...]
Thermal conductivity of composite materials
A composite material can be defined as a material in which two or more different materials are bonded together. It is sensible to make a distinction between macrocomposites and microcomposites. The first group usually has a layered structure, and PCBs are the main application. The second group looks uniform to the naked eye; materials from this group are often used for packages … [Read more...]
Thermal analysis moves into the 21st century
In the last decade, we've come a long way in the application of thermal analysis to the design of electronics. And there's no sign of the pace of innovation changing. Engineers are still being challenged to build faster, smaller and cheaper products in ever-decreasing design times. Fortunately, the engineering software industry has been able to respond by providing tools that … [Read more...]
The history of power dissipation
Figure 1. Transistor counts on Intel processors from inception to present superimposed on Moore's prediction. In his fascinating book, "Visions," Michio Kaku [1] predicts a future driven by silicon and quantum computers. Based on the information we have today, it is intriguing to speculate how such a highly silicon-based society might function and evolve. Being a thermal … [Read more...]
- « Previous Page
- 1
- …
- 461
- 462
- 463
- 464
- 465
- …
- 481
- Next Page »
