Today's electronics are becoming smaller and faster, resulting in increased power densities and greater risk of thermal problems. Thermal dissipation requirements thus need to be satisfied by the use of several cooling mechanisms. The cooling systems may include conduction, convection and radiation cooling. Conduction can be the most efficient mode of heat transfer and about … [Read more...]
Low temperature electronic cooling
The potential for low temperature enhancement of CMOS performance has been recognized for some time, going back as far as the late 1960's and mid-1970's. A collection of articles focusing on low temperature electronics is included in the book by Kirschman(1) where a number of researchers [2-6] have identified the advantages of operating electronics at low temperatures. Jaeger … [Read more...]
High accuracy thermal interface resistance measurement using a transient method
Heat dissipation of active devices has become one of the limiting factors in further miniaturization. While component manufacturers succeed in decreasing the overall thermal resistance of their packages, the thermal interface resistance to the board becomes the next limiting factor. Therefore, understanding interface and contact resistances becomes increasingly important for … [Read more...]
Determining the junction temperature in a semiconductor package, part IV – localized heat generation on the die
In the standard thermal test environment, thermal test chips are designed to dissipate the applied power uniformly over most of the die surface. However, in many situations of practical interest, the power is dissipated over a localized area of the die. This column provides calculation methods to deal with the latter situation. Figure 1 illustrates the situation of interest … [Read more...]
Thermal challenges in the telecom and networks industry
Figure 1: Telecom Equipment Operating EnvironmentsThere are two main reasons for doing thermal design in the telecommunication industry. The first is to ensure functionality of the equipment and system when subjected to extreme environments. The second is to ensure high dependability of the network. While doing thermal design, many challenges must be kept in mind: the … [Read more...]
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