One of the primary tasks of the thermal engineer is to determine the temperature of the junction (active circuitry on an integrated circuit) for the various packages in a system. Measurements performed in the industry-standard test environment are often used in this endeavor. The most common thermal metric [1,2] is the junction-to-air thermal resistance, JA (pronounced theta, … [Read more...]
Use of junction-to-board thermal resistance in predictive engineering
The readers of "Electronics Cooling" are familiar with the reasons why the junction to ambient thermal resistance [1], JA or RJA, is an inadequate description of the thermal performance of an integrated circuit. Likewise, you realize that vendors cannot continue to state the integrated circuit will work at a specified ambient temperature (55°C, 70°C, 85°C, or 125°C) as device … [Read more...]
The thermal conductivity of pure metals
As discussed previously in this section, the measurement of the thermal conductivity is notoriously difficult. The consequence is that, while the measurement accuracy by individual researchers is claimed to be of the order of 2%, laboratories participating in round-robin tests produce results differing from each other by 15% or more [1]. Even the measurement of pure metals is … [Read more...]
Improving productivity in electronic packaging with flow network modeling (fnm)
As the complexity and power density of electronics systems increase, so too does the demand for tools to improve both product quality and designer productivity. This is especially true for thermal designers who use Computational Fluid Dynamics (CFD) tools for thermal designs. Several important factors are driving this trend: System complexity has increased to the point that … [Read more...]
Graphite fiber reinforced al and cu alloys for thermal management applications
Technological advances in the electronics industry have revolutionized the way the world communicates and conducts business. Today's electronic products, from cellular phones to sophisticated imaging satellites, demand lightweight, low-cost materials that provide more functionality in less volume. To meet these challenges, electronic systems must dump large amounts of waste … [Read more...]
- « Previous Page
- 1
- …
- 465
- 466
- 467
- 468
- 469
- …
- 481
- Next Page »
