Introduction Recent advances in mobile communications have enabled large scale development of handheld telecommunication products. Such products include cellular phones, pagers, two-way radios, personal digital assistants (PDAs), and other wireless and wireline equipment. The technological enhancements at device, package, and system levels have resulted in increased … [Read more...]
Thermal interface under a plastic quad flat pack
Introduction Plastic components are designed so that the heat is dissipated by forced or natural convection. The use of plastic packages under conditions where neither cooling method is available introduces new challenges. High heat-dissipation plastic packages require a large-area solid heat sink in order to transfer the heat into the copper thermal lands on the printed … [Read more...]
The thermal conductivity of silicon
The most important material within the semiconductor industry is Silicon. When dealing with electro-thermal device modelling, or the interpretation of fast transient techniques for the measurement of thermal impedance, thermal conductivity of Silicon is required. For steady state thermal analyses at the board and system level, however, accurate values are not required, because … [Read more...]
Pressure drop coefficients for thin perforated plates
Almost everyone working on pressure drop coefficients of perforated plates encounters the work of I.E. Idelchick {1}. A plethora of graphs or equations - some of which are impossible to evaluate quickly - must then be addressed. To simplify this issue for the reader, this month's Technical Data page has been designed to provide an overview of this information. When focusing on … [Read more...]
Interaction of the system and module-level thermal phenomena- a flip-chip/BGA example
Fig. 1: Levels in a computer environment. Introduction Increasing demands for higher performance in microprocessors have a direct effect on chip power and heat generation. Increased function and miniaturization of the packages result in thermal challenges that require a thorough understanding of the system's thermal performance under all possible field conditions. Regardless … [Read more...]
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