Almost everyone working on pressure drop coefficients of perforated plates encounters the work of I.E. Idelchick {1}. A plethora of graphs or equations - some of which are impossible to evaluate quickly - must then be addressed. To simplify this issue for the reader, this month's Technical Data page has been designed to provide an overview of this information. When focusing on … [Read more...]
Interaction of the system and module-level thermal phenomena- a flip-chip/BGA example
Fig. 1: Levels in a computer environment. Introduction Increasing demands for higher performance in microprocessors have a direct effect on chip power and heat generation. Increased function and miniaturization of the packages result in thermal challenges that require a thorough understanding of the system's thermal performance under all possible field conditions. Regardless … [Read more...]
Forced convection cooling inside an electronics enclosure
Introduction One of the more complex thermal problems in electronics is the modeling of complete systems, such as an enclosure containing electronic components. A typical example would be a power supply, including heat sinks and a cooling fan. This problem becomes more difficult when there are multiple heat sinks and other large components arranged in an arbitrary manner inside … [Read more...]
Conduction heat transfer in a printed circuit board
In this issue, we examine heat flow in a printed circuit board (PCB), which typically is a layered composite consisting of copper foil and a glass-reinforced polymer (FR-4). A cross-sectional view of such a laminated structure is illustrated in Figure 1. The Figure indicates the numbering system that will be used for indicating the different layers, numbered 1 through to … [Read more...]
Thermal management of outdoor enclosures using phase change materials
Telephone equipment has traditionally been housed in large buildings, sheds and outdoor cabinets. The cooling of these facilities has been carried out using traditional methods. However, in many of the new systems being developed and deployed such as broadband ISDN, cellular and/or cable, heat dissipation densities will increase substantially [1]. Furthermore, the introduction … [Read more...]
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