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Thermal management of telecommunications cabinets

 

Figure 1. Thermal analog model of an OSP enclosure Introduction Over the past twenty years, telecommunications electronics have become increasingly decentralized - moving ever furtherfrom the controlled and protected environment of the Central Office intothe Outside Plant (OSP). The OSP environment contains rain and humidity,dust and pollutants, significant daily and annual … [Read more...]

One-dimensional heat flow

 

The simplest heat flow situation is that described as “one-dimensional heat flow”. The Figure illustrates a one-dimensional heat flow situation. It shows heat flowing in one face of an object and out the opposite face. Each face is at a uniform temperature. There is no heat flow out of the sides of the object. The cross- sectional area of the object in the direction of heat … [Read more...]

Integrated thermal network models are still useful

 

Figure 1: Basic discretization of parallel board arrangement Introduction While electronic systems thermal managementgrows in complexity, the challenge of integrating thermal constraints intothe product design process remains constant. The evolution of compactcomponent models highlights the need to predict integrated systemperformance on the basis of the individual component … [Read more...]

Highly emissive ion beam textured surfaces for improved cooling of electronic devices

 

Continuous improvements in the cooling of electronic systems will berequired to keep pace with the rapid development of higher power chips.Currently, effective cooling relies (in part) on high surface area heatexchangers. Further improvements could be realized by increasing thesurface area of these devices. However, increasing the size of heatexchanger components is not a … [Read more...]

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