Background The cooling of electronics and telecom equipment is essential to the proper operation of all applications. Removal of generated heat from these systems has been traditionally carried out via heat conduction/convection techniques. Phase Change Materials (PCMs) are a relatively new concept for the cooling of electronic systems. A PCM is used to absorb peak energy … [Read more...]
Thermally Conductive, Flame Retardant Epoxy Adhesive for Avionics
Master Bond’s EP93AOFR is a two-part thermally conductive epoxy adhesive that offers superior heat dissipation for a wide range of electronic applications. It can be used in encapsulation and potting applications, as well as in bonding, sealing, and coating. According to Rohit Ramnath, Senior Product Engineer, "This flame retardant non-halogenated system is not only … [Read more...]
SimScale is Teaching Engineers How to Use Web-based CFD Simulation for Electronics Cooling
Munich, February 13, 2019 — SimScale is announcing a free webinar on 19th of February to teach engineers how to ensure efficient cooling, test multiple design versions and prevent thermal damage in electronics design. CFD simulation of a water-cooled electronic device (Source: SimScale) In the electronics industry, neglecting to effectively cool a component within a … [Read more...]
Thermoelectric Assemblies Optimize Thermal Performance in any Outdoor Environment
Laird Thermal Systems has introduced a series of thermoelectric assemblies (TEAs) designed for use in outdoor environments. The Outdoor Cooler Series are compact (cooling objects via convection) air-to-air TEAs said to provide a lower total cost of ownership by maintaining the appropriate temperature range using minimal energy due to its high coefficient of performance … [Read more...]
Using Wide Bandgap Materials in Power Electronics Presents a New Set of Thermal Challenges
The power electronics industry has reached the theoretical limits of silicon and now is moving to other semiconductor materials whose performance meets the requirements of today’s high power density systems. A number of techniques are being used to overcome the thermal limitations of power modules. One approach is using semiconductor materials which are able to bypass Si’s … [Read more...]
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