Figure 1 Analog Devices LTM4700 combines high power with the energy efficient performance needed to reduce data center cooling requirements. To reduce data center infrastructure cooling requirements step-down DC/DC power regulators must combine high power with energy efficient performance. To that end Analog Devices has expanded its suite of Power by Linear … [Read more...]
CoolIT Systems Partners with Intel to Develop Direct Liquid Cooling solutions for Xeon Scalable Processors
CoolIT Systems has partnered with Intel to develop Direct Liquid Cooling solutions for Intel Xeon Scalable CPUs, including the recently announced Advanced Performance processors (codename Cascade Lake) coming in the first half of 2019. Cascade Lake represents a new class of Intel Xeon Scalable processors designed for demanding high-performance computing (HPC), artificial … [Read more...]
New Way to Cool Data Center Chips Uses Laser Metal Printing
Figure 1: Researchers tested their technique by printing the Binghampton Univeristy logo with a 3D metal laser printer. Traditionally, electronics are cooled using a heat sink that transfers heat into the air or a liquid coolant. For the heat sink to work, it has to be attached to the CPU or the graphics processor via a thermal interface material, which helps facilitate the … [Read more...]
Making Electrothermal Co-Simulation a Reality
Taking on the challenge of placing ever more powerful electronics into increasingly small and complex devices has meant that electronic and thermal simulation are now vital parts of the engineering design flow. But with smaller geometries and higher power densities these challenges only get more acute. For starters the fact that the physical space within which electronic … [Read more...]
One Component Glob Top Epoxy Meets NASA Low Outgassing Specifications
Master Bond EP17HTND-CCM is a new single component epoxy that is not premixed and frozen. It is more convenient to handle, apply and store than typical two component glob top systems. This black, heat curable compound has a flowable paste consistency ideal for glob top, chip coating and bonding applications. EP17HTND-CCM meets NASA low outgassing specifications and is … [Read more...]
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