We're hiring a talented sales professional to support Interference Technology and our other publications. Read more below! And if you're interested, contact Graham Kilshaw at graham@item.media Title: Director of Business Development ITEM Media (Publisher of Electronics Cooling), Philadelphia region, PA Compensation Competitive base plus commission Multiple … [Read more...]
UV Curing System for Bonding, Coating and Sealing
Hackensack NJ November 2018. - Apart from their traditional use as fastening materials, adhesives also find wide application in bonding and encapsulation in segments as diverse as military/aerospace, medical, automotive, and industrial. Adhesive systems can differ in temperature resistance, thermal cycling resistance, viscosity, flexibility, cure times and other … [Read more...]
Some Remarkable Highlights at EMC EUROPE 2018 Amsterdam Symposium
This top-level technical and scientific event is the most important English-speaking EU annual EMC symposium and exhibition. The program may be downloaded here: https://www.emceurope2018.org/footer/final-programme-opt.pdf It travels always to a different EU country. About 50% of the submitted papers were rejected in the review process. Close … [Read more...]
Get the Right Terminations for Optimal Liquid Cooling
Sponsored by CPC Due to the demand of liquid cooling connections in high performance computing, many engineers are now looking to find the right components that facilitate optimal cooling. The foundation begins with the combination of the right termination and connection. Read our case study on how to ensure you’re getting the right termination for a leak-free HPC … [Read more...]
How My Electronics Should Be Oriented: A Thermal Point of View Study to Understand the Impact of Orientation on Internal Air Temperature
Authored by: Tejas Manohar Kesarkar and Nitesh Kumar Sardana Abstract— Modern day electronics work in varied thermal conditions. The increase in demand of electronics has led to miniaturization, use of plastic housing, and more applications from the existing electronics in the market. The model for analysis consists of multi-layered Cu-FR4 Printed Circuit Board (PCB) … [Read more...]
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