FLIR Systems, Inc. announced the launch of the FLIR ETS320 thermal imaging solution for electronics testing in engineering benchtop environments. As the first FLIR camera designed specifically for benchtop work in testing and analyzing the thermal characteristics of electronic components and printed circuit boards (PCBs), the FLIR ETS320 aims to advance testing and diagnosis … [Read more...]
New Low Power Consumption Fan Released
SANYO DENKI has developed and launched the San Ace 120 9GA type 120 x 120 x 25 mm low power consumption fan. It features industry-leading energy efficiency and static pressure. (This information is based on our own research as of January 12, 2017, collected among 120 × 120 × 25 mm axial DC cooling fans.) It is suitable for use in medical equipment, electrical measuring … [Read more...]
Recent Advancements in Oil Immersion Cooling
This blog summarizes some of the recent findings from an ongoing project “An In-Depth Understanding of Oil Immersion Cooling Strategies for Data Centers” at the University of Texas at Arlington (UTA). This project is supported by NSF I/UCRC grant in the program “Energy-Smart Electronic Systems” (ES2) and by many industry partners. Complete immersion of servers in … [Read more...]
A Brief Overview of Thermal Management in Printed Electronics
Editor’s Note: This is the first in a series of articles to appear in Electronics Cooling addressing emerging areas for electronics thermal management. Printed electronics (PE) is one of the key enabling technologies of many electronic products that we take for granted today, not just in functional feasibility but also in cost that seems to be on a continuous downward trend. … [Read more...]
Ultra Low Thermal Resistant Adhesives for Electronic Applications
Sponsored by Master Bond As advances in epoxy and silicone materials constantly evolve, manufacturers of advanced electronic systems will find that adhesives offer the ability to meet nearly any combination of requirements for thermal, environmental, and structural stability. As product manufacturers face greater challenges adhesives are uniquely qualified to meet … [Read more...]
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