Sponsored by Master Bond As advances in epoxy and silicone materials constantly evolve, manufacturers of advanced electronic systems will find that adhesives offer the ability to meet nearly any combination of requirements for thermal, environmental, and structural stability. As product manufacturers face greater challenges adhesives are uniquely qualified to meet … [Read more...]
SEMI-THERM 33 2017 Exhibits Highlights – Part 2
Editor’s Note: This is the 2nd of a two-part summary from SEMI-THERM 33. Click here for Part 1. SEMI-THERM 33 concluded last week at Silicon Valley, CA and Electronics Cooling was the only media and content provider present on the exhibit floor. We take this opportunity to thank our readers and contributors who stopped by our booth to learn about our plans for this year … [Read more...]
Recent Research in TIMs
Please find below some recent research in Thermal Interface Materials (TIMs). Low melting alloy composites as thermal interface materials with low thermal resistance Haoran Wen, Yaqiang Ji Kai Zhang, Matthew M.F. Yuen, S.W. Ricky Lee, Xian-Zhu Fu, Rong Sun & Ching-Ping Wong Low melting alloy is mixed with Cu filler as thermal interface materials. The thermal … [Read more...]
SEMI-THERM 33 2017 Exhibits Highlights – Part 1
SEMI-THERM 33 concluded last week at Silicon Valley, CA and Electronics Cooling was the only media and content provider present on the exhibit floor. We take this opportunity to thank our readers and contributors who stopped by our booth to learn about our plans for this year including 2017 Thermal Live! We are so pleased to know that many of you like our content, our new … [Read more...]
Fix Your Electronics Cooling Problems with Autodesk
Join Autodesk's "Fix Your Electronics Cooling Problems" webinar on April 6th, 2:00 pm ET. Electronics used within products are constantly changing and improving, but the need to ensure proper cooling of these components remains. To maximize product performance, engineers need to overcome common electronics cooling challenges like: Reduction in product size Increase … [Read more...]
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