Sponsored by Cradle Learn just how easy it is to use PICLS with our PICLS - At a Glance Webinar! Cradle PICLS is designed to deliver high capability at low cost with minimal difficulty so that more PCB designers can undertake thermal analyses and achieve better product design. Use PICLS to rearrange components on a PCB and immediately see thermal transfer and changes to … [Read more...]
A Novel Approach to Development of a Thermal Capacitor
INTRODUCTION In terrestrial or air-borne electrical and electronic systems, cooling requirements can be unsteady due to spikes in heat load, or changes in ambient conditions. Such an event results in a sharp rise in system temperature or temperature cycling thus possibly reducing the system reliability. In the electrical domain, fluctuations in voltage are managed by using … [Read more...]
Thermal Management of GPU-Enabled Servers in Data Centers
Since the introduction of CUDA (Compute Unified Device Architecture, an acronym that is no longer in practice) in 2007, hundreds of millions of computers with CUDA parallel architecture-capable GPUs, or graphics processing units, have been shipped. If you have a gaming desktop, laptop with Nvidia GeForce GTX 1080 graphics card or Nvidia Shield, you are most likely familiar with … [Read more...]
Low Cost Plastic Films Lower Exposed Surface Temperatures by 10°C
Low-emissivity (Low-E) films are not new –they represent a mature technology in which a metal-oxide coated surface emits low levels of radiant thermal energy. Low-E films are widely used on window glasses in energy-efficient buildings. Low-E materials include metals like Aluminum foil which has a thermal emissivity /absorptance of 0.03 which means that it reflects 97 percent of … [Read more...]
U.S. Patent for Modular Heat-Transfer Solutions Issued
CoolIT Systems, Inc. (CoolIT), the world leader in energy efficient liquid cooling solutions for HPC, Cloud and Enterprise markets, today announced that the United States Patent and Trademark Office has issued US Patent No. 9,496,200 covering modular heat-transfer solutions to cool an array of independent servers for rack based data center installations. This proprietary … [Read more...]
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