In one of our previous blogs on Electronics Cooling of Humans, we highlighted some of the on-going research projects at various universities in the US sponsored by ARPA-E. These projects are expected to achieve a step-change in the cooling technology of wearable fabrics and the costs of manufacturing them. It is worth noting that prior to the effort sponsored by ARPA-E, thermal … [Read more...]
DuPont Launches New Portfolio of Electronic Thermal Management Solutions
DuPont Electronic Materials has recently announced the launch of a new portfolio of thermal solutions under the brand name DuPont™ Temprion™ thermal management materials. The Temprion™ portfolio is completely non-silicone and currently includes thermal greases, thermal gap fillers, electrically insulating films and adhesive thermal tapes. These new thermal management … [Read more...]
Patent Application Review: Integrated Heat Sink and EMI Shield Assembly (US 20160227673)
Editor’s Forward: The ITEM Media team has launched our brand new Electronics Cooling website today! Take a look around – the new layout is responsive with easier navigation and encourages user interaction, with many new features still to come! We are very interested in your feedback, so please use the form below this week’s blog post to log in and post your … [Read more...]
New Registration Process Makes Requesting Samples & Quotes Faster
Fujipoly has created an online suite of features that allow engineers to request free samples and/or quotes with the click of a mouse. The registration process takes under 2 minutes to complete and even allows users to create default shipping and billing locations. The “Request a Sample” feature guides engineers to the product by using drop-down menus to specify Sarcon® … [Read more...]
New Convenient Thermal Analysis Conceptual Design Tool Released
Cradle has recently released PICLS V2, which is now simply PICLS (whereas V1 is now called PICLS Lite). PICLS has external file interfaces for IDF 3.0, Gerber wiring data, and drill data import. In addition, parts/components created for a model can be saved in the Library for future shared use. PICLS can also model plate fin and heat dissipation plate heat sinks. In PICLS … [Read more...]
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