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Electronics Cooling

Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting

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Understand Organic PCM Differences

 

Microtek has a large selection of organic PCMs, offered in 3 main forms: PCM, Microencapsulated PCM, and Macroencapsulated PCM. PCM applications include shipping and packaging, solar energy systems, radiant heat flooring, industrial/commercial apparel (work vests, etc.), and thermal pouches. Microencapsulated PCM applications include high performance apparel, bedding, … [Read more...]

Design Considerations When Using Heat Pipes

 

By George Meyer, Celsia Inc. Introduction This article is intended to offer design guidance when using heat pipes for the most prevalent types of electronics applications: mobile to embedded computing and server type applications with power dissipation ranging from 15 W to 150 W using processor die sizes between 10 mm and 30 mm square.  Discussion is constrained to those … [Read more...]

Tech Brief: Commercially-available Thermally Enhanced Polymer Composite Materials Characteristics

 

Peter Rodgers, Editor Valérie Eveloy, The Petroleum Institute Introduction The development, characterization, and implementation of polymer composite materials for the thermal management of electronic equipment has recently began to attract attention [1,2].  The enhanced thermal conductivity, low density, low cost, ease of manufacture and corrosion resistance of polymer … [Read more...]

Webinar and Report Available On-Demand Now

 

The Critical Power Expo has recently released their report and webinar on “Key Trends on the Design and Operation of Power Systems for Mission-Critical Environments” free and on-demand. The exclusive report explores the key trends that are emerging in provision of power systems for mission-critical facilities across multiple industries, and is accompanied by the one-hour … [Read more...]

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