by MP Divakar, PhD, Stack Design Automation (www.stack-da.com) Technical Editor, Electronics Cooling Online It gives me great pleasure to join the electronics thermal management community as the Technical Editor for the online edition of Electronics Cooling Magazine. Electronics-Cooling.com remains the preeminent online resource for all things related to the cooling of … [Read more...]
Ultra-Thin Thermoelectric Cooler Provides Precise Temperature Control for Optical Electronics
Phononic recently announced its pico-TEC series, a high-performance solid-state thermoelectric module (TEM) designed to provide precise temperature control in order to meet the unique thermal management requirements of optoelectronics and fiber optic modules. The pico-TECs are manufactured using advanced automated semiconductor fabrication technology and ultra-thin form factor … [Read more...]
New Power Supply Units Introduced
SilverStone’s Strider Platinum series has two new additions, the ST1000-PT and ST1200-PT units. Along with being the world's smallest 80 PLUS Platinum, fully-modular ATX power supplies, the ST1000-PT and ST1200-PT units are two of six, all with capacities ranging from 550W to 1.2 kW. Both new high-end Strider Platinum units have restricted dimensions, with only 18cm depth, and … [Read more...]
Thermal Conductor Research Project Joined by UH Physicist
(July 21, 2016) University of Houston’s MD Anderson Professor and physicist, Zhifeng Ren, has joined the $7.5 million collaboration to develop a material with a higher conductivity than diamonds. “Earlier research conducted in this field has anticipated the potential of boron arsenide to be a better thermal conductor than diamonds,” said Ren, “David Broido, a Boston College … [Read more...]
New Thermally Conductive Interface Material Announced
Noelle Industries, a division of Creative Materials, Inc, has recently introduced their new thermally conductive interface material, the 804-24. The 804-24 is a one-component thermal grease that has excellent heat dissipation properties, low sag, and no bleeding. It is designed to dissipate heat away from electronic components such as semiconductors and temperature sensing … [Read more...]
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