(July 13, 2016) Recently, associate professor Baratunde Cola of the Woodruff School of Mechanical Engineering at the Georgia Institute of Technology uncovered the “potential of silicon dioxide nanoparticles coated with a high dielectric constant polymer for cooling power-hungry electronic devices,” reported Hexus.net. According to Hexus, “the cooling occurs as the result of a … [Read more...]
Electronics Cooling June 2016 Issue Now Online
Don’t miss out on the June 2016 Issue of Electronics Cooling, which includes feature articles on The Hidden Risk of Invisible Airflow Imbalance in Data Centers, Application of Phase Change Materials in Handheld Computing Devices, and more. If you would like to receive your free copy of Electronics Cooling click here to subscribe. Read the June 2016 issue here … [Read more...]
DesignCon 2017
DesignCon 2017 January 31 - February 2, 2017 Santa Clara, California DesignCon, the premier conference for chip, board, and systems design engineers; returns to Silicon Valley for its 22nd year. DesignCon serves the high speed communications and semiconductor communities offering state-of-the-art design methodologies, applications, technologies, and unparalleled networking … [Read more...]
APEC 2017
APEC 2017 March 26 - 30, 2017 Tampa, Florida To learn more, click here. … [Read more...]
Design Automation Conference (DAC) 2017
Design Automation Conference (DAC) 2017 June 18 - 22, 2017 Austin, Texas To learn more, click here. … [Read more...]
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