By Andras Poppe and Marta Rencz The 30th THERMINIC (Thermal Investigations of ICs and Systems) workshop was held on 25-27 September 2024 in Toulouse, France at the Mercure Toulouse Centre Compans. Jean-Pierre Fradin (Icam, France) and Patrick Tounsi (INSA Toulouse & LAAS – CNRS) as local organizers and co-program chairs of the 2024 THERMINIC did a great job: Over 110 … [Read more...]
Dynamic Temperature Measurements: Tools Providing a Look into Package and Mount Structures
Today it is commonly accepted that dynamic thermal measurements, which have been used for more than 20 years [1], [2], [3], [4], are superior to steady-state ones. The temperature vs. time function - often called the thermal step-response function, heating curve, or thermal impedance curve - is characteristic of the chip-to-ambient structure, including even different cooling … [Read more...]
