The increased integration density of electronic components and subsystems, including the nascent commercialization of 3D chip stack technology, has exacerbated the thermal management challenges facing electronic system developers. The sequential conductive and interfacial thermal resistances associated with the prevailing “remote cooling” paradigm in which heat must diffuse … [Read more...]
Computer-related thermal packaging at the millenial divide
Examples of state-of-the-art thermal management solutions at the dawn of the 21st century (left to right): a TCM module, a high-density heat sink, and an ultra performance, low profile fan-sink. Thermal management has served as a key enabling technology in the development of advanced microelectronic systems and has facilitated many of the "Moore's Law" [Moore, G.E., 1975] … [Read more...]
