Bernie Siegal Thermal Engineering Associates, Inc. Introduction One of the key power generation technologies in the current “green” revolution is the solar photovoltaic cell (SPVC). This unit directly converts solar energy into useful amounts of electrical energy in an increasingly economically-efficient manner. But the SPVC is not a new device – in semiconductor device … [Read more...]
An alternative approach to junction-to-case thermal resistance measurements
As more and more integrated circuits dissipate power at levels once reserved for power discrete devices, junction-to-case thermal resistance (JC or RJC) remains as important as ever. The difficulties in making JC measurements often leads to values that do not accurately indicate true junction temperature (TJ). The measurement difficulties are usually two-fold. First is … [Read more...]
Elements of device thermal characterization
The increased power dissipation of today's integrated circuits has made knowledge of thermal resistance important to those who manufacture and use these devices. Thermal resistance is a device (i.e. semiconductor chip mounted in a package) parameter that is used to calculate junction temperature if the device power dissipation is known or can be estimated. This parameter is a … [Read more...]
