The International Technology Roadmap for Semiconductors [1] predicts high performance processor power density to more than double by the year 2024, while during the same time allowable junction temperature will decrease from 90oC to 70oC, reducing the junction-to-ambient temperature difference to nearly half. This combined challenge to cooling will require the total thermal … [Read more...]
Review of Low Profile Cold Plate Technology for High Density Servers
Introduction Water cooling of computers was introduced more than twenty years ago, but had disappeared from the mainstream by the mid 1990s. The conversion of chip technology from bipolar to CMOS (complementary metal oxide semiconductor) was the main reason. As chip powers continue to increase, water cooling appears likely to become mainstream again. In the current market, the … [Read more...]
