KEYWORDS Thermal Resistance | Thermal Interface | Semiconductor Test | Durability | Cycling | Device Under Test NOMENCLATURE DUT Device Under Test OSAT Out-Sourced Assembly and Test Rth Thermal Resistance S/TB Semiconductor Test and Burn-In TIM Thermal Interface Material ABSTRACT Many thousands of thermal interface materials (TIMs) exist due to the very wide … [Read more...]
About the Author
David L. Saums
Dave has thirty-nine years of business development and technical marketing experience with advanced packaging and thermal materials, components, and two-phase liquid cooling systems. He has chaired or given technical conference presentations in eight countries on thermal management topics. Dave is general chair for the IMAPS ATW on Thermal Management (eighteen years), has participated with the IMAPS France thermal and packaging workshop organizing committee (fourteen years), and served as general chair for Semitherm in 2006. Dave founded and has operated a full-time consulting business for fourteen years to assist in applying new materials and technologies for applications as diverse as handheld devices and HEV powertrain inverters. He has made hundreds of visits to OEM engineering groups globally.
Application of Metallic TIMs for Harsh Environments and Non-flat Surfaces
Co-authored by: David L. Saums and Tim Jensen DS&A LLC and Indium Corporation INTRODUCTION Electronic systems, implemented in such diverse industries as aerospace, vehicle, geothermal exploration, and mobile devices with a range of more challenging application conditions, create new challenges for component and material reliability. Non-flat mounting conditions, … [Read more...]
Technical Brief: Developments in CTE-Matched Thermal Core Printed Circuit Boards
Expansion-matching materials development for semiconductor packaging has traditionally focused on ceramic, organic, metallic and composite materials used for packaging of silicon die for a broad variety of applications in many types of equipment markets. Market segments where these types of materials are used include integrated circuits, RF devices and components for … [Read more...]
Developments with metallic thermal interface materials
Electronics industry needs for improved performance of thermal interface materials (TIMs) are driving continued reductions in thermal resistance. These reductions are being achieved with materials that become liquidous or near-liquidous at predictable operating temperatures, with extremely high thermal conductivity filler materials, or with both. Metallic alloys with low … [Read more...]
