The AIST Group (consisting of National Institute of Advanced Industrial Science and Technology (AIST) and AIST Solutions Co.) and NGK INSULATORS, LTD. (NGK) have embarked on joint research regarding validating methods for evaluating thermal diffusivity of silicon nitride ceramic substrates used for power semiconductor components (power semiconductor modules) and other such … [Read more...]
About the Author
Electronics Cooling
Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.
Choosing the Right Liquid Cooling Quick Disconnects — Key Considerations for Optimal Thermal Management
By Cameron Koller, Marketing Development Manager, Parker Hannifin Quick Coupling Division As technology evolves, one challenge remains constant: heat. Servers, supercomputers, and data centers generate massive amounts of heat, with power densities often reaching 10 to 20 kilowatts per rack and, in some cases, significantly exceeding 50 kW in high-performance computing … [Read more...]
Hydraulic and Thermal Characteristics of a Double-Sided Cold Plate – Part 2
Tesla Tear Down, CFD Validation, and Machine Learning to Determine the Performance Limit This study investigates the hydraulic and thermal characteristics of the TESLA AUTOPILOT HW2.5 MODEL 3 Y, which features a double-sided cold plate with PCBs attached on both sides. We present a step-by-step teardown process of the unit, measuring internal dimensions, fin locations, … [Read more...]
Simulation of Solder Fatigue Effects on Typical BGA Package due to Material and Temperature Variations – Part 1
Abstract The past two decades have seen many approaches to solder fatigue and solder joint life published. This subject has proved difficult as various failure mechanisms are proposed and examined. While these theoretical bases are discussed, it often leaves the end developer in a difficult situation as to how to apply an accurate simulation approach to fatigue failure for a … [Read more...]
A New Patented Approach to Diffusion Bonding Offers Speed and Improved Process Control
An innovative process is reducing diffusion bonding time of aluminum and aluminum alloys by up to 50%, energy use by 30%, and improving quality. Contract manufacturers and design engineers in the aerospace, semiconductor, high-power electronics, and energy industries have been turning to diffusion bonded metals to produce new cutting-edge innovations. Diffusion bonding is … [Read more...]
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