An innovative process is reducing diffusion bonding time of aluminum and aluminum alloys by up to 50%, energy use by 30%, and improving quality. Contract manufacturers and design engineers in the aerospace, semiconductor, high-power electronics, and energy industries have been turning to diffusion bonded metals to produce new cutting-edge innovations. Diffusion bonding is … [Read more...]
About the Author
Electronics Cooling
Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.
Pfannenberg USA Introduces PTF 1200 High CFM Top-Mounted Filter Fan
Lancaster, NY – Pfannenberg, Inc., a global leader in thermal management and signaling technologies, proudly introduces the PTF 1200, an industry leading high CFM top-mounted filter fan designed to redefine cooling solutions for various industries. This compact yet powerful innovation boasts an unimpeded airflow rate of up to 589 CFM, making it a game-changer in the realm of … [Read more...]
Summary of SEMI-THERM 40 Conference
The SEMI-THERM 40 Symposium was held March 25-28, 2024 at the Double Tree Hotel in San Jose, CA. Program organization was led by General Chair Alex Ockfen (Meta), Program Chair dr. Lieven Vervecken (Diabatix), and Program Vice Chair dr. Navid Kazem (Arieca). It featured a variety of activities including technical short courses, technical sessions, invited presentations, vendor … [Read more...]
Theta-JC Measurements: Steady-State Compared to Transient Methods
Thermal characterization plays a vital role in electronic package reliability testing, design, and verification of manufacturing processes. The reliability of electronic packages is controlled, in part, by ensuring the maximum junction temperature is not exceeded during operation. Systems such as cell phones, electric vehicles and computers, must operate with die temperatures … [Read more...]
Inventec Thermasolv™ Fluorinated Fluids vs. Hydrocarbons for Immersion Cooling
At the Thermal Live Spring Summit 2024 hosted by Electronics Cooling, discussions revolved around groundbreaking developments in thermal cooling technologies. Here is a detailed summary of key takeaways from Inventec's presentation: 1. Industry-specific Development — ThermoSolv Fluorinated Fluids vs. Hydrocarbons: The session kicked off with an in-depth exploration of the … [Read more...]
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