The AIST Group (consisting of National Institute of Advanced Industrial Science and Technology (AIST) and AIST Solutions Co.) and NGK INSULATORS, LTD. (NGK) have embarked on joint research regarding validating methods for evaluating thermal diffusivity of silicon nitride ceramic substrates used for power semiconductor components (power semiconductor modules) and other such … [Read more...]
About the Author
Electronics Cooling
Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.
SPEAG combines CMX500 OBT with the DASY83D system for automated SAR testing of 5G NR devices
Munich, February 10, 2025 SPEAG and Rohde & Schwarz expand their long-term collaboration with the combination of the CMX500 wideband radio communication tester with the DASY83D utilising the enhanced DASY8 Application Programming Interface. This combination allows manufacturers of wireless devices to perform Specific Absorption Rate tests of 5G FR1 devices using the … [Read more...]
Choosing the Right Liquid Cooling Quick Disconnects — Key Considerations for Optimal Thermal Management
By Cameron Koller, Marketing Development Manager, Parker Hannifin Quick Coupling Division As technology evolves, one challenge remains constant: heat. Servers, supercomputers, and data centers generate massive amounts of heat, with power densities often reaching 10 to 20 kilowatts per rack and, in some cases, significantly exceeding 50 kW in high-performance computing … [Read more...]
Hydraulic and Thermal Characteristics of a Double-Sided Cold Plate – Part 2
Tesla Tear Down, CFD Validation, and Machine Learning to Determine the Performance Limit This study investigates the hydraulic and thermal characteristics of the TESLA AUTOPILOT HW2.5 MODEL 3 Y, which features a double-sided cold plate with PCBs attached on both sides. We present a step-by-step teardown process of the unit, measuring internal dimensions, fin locations, … [Read more...]
Simulation of Solder Fatigue Effects on Typical BGA Package due to Material and Temperature Variations – Part 1
Abstract The past two decades have seen many approaches to solder fatigue and solder joint life published. This subject has proved difficult as various failure mechanisms are proposed and examined. While these theoretical bases are discussed, it often leaves the end developer in a difficult situation as to how to apply an accurate simulation approach to fatigue failure for a … [Read more...]
- 1
- 2
- 3
- …
- 341
- Next Page »
