Laird Technologies has announced a new series of miniature thermoelectric modules for applications where temperature stabilization of sensitive optical components in photonics, telecom, medical and consumer markets is critical. Built using Laird Tlam thermally conductive circuit boards instead of traditional ceramic-based circuit boards, the new TIam OptoTEC series improves the … [Read more...]
Research Could Lead to New Thermal Flow Control Devices
Researchers have proposed a new method of controlling heat flow similar to the way electronic components handle electrical current that could deliver more efficient thermal management in a variety of applications. Developed by scientists at Purdue University, the technology utilizes tiny triangular or T-shaped structures made of graphene nanoribbons to control phonons, quantum … [Read more...]
Carbon Nanotubes Boost Microprocessor Cooling
Researchers from the U.S. Department of Energy have developed a new technique that combines carbon nanotubes and organic materials to enable more efficient cooling of microprocessor chips. While carbon nanotubes have long been known to offer high thermal conductivity, widespread application in cooling systems has proven difficult because of their high thermal interface … [Read more...]
Gallium Nitride Contributes to Laser Cooling Breakthrough
Researchers have discovered a new method of engineering gallium nitride (GaN) that could help eliminate the need for current heat dissipation methods. Considered one of the most important semiconducting materials after silicon, GaN’s hardness, crystalline structure and wide bandgap make it ideal for a variety of applications in the optoelectronics industry, including LEDs, … [Read more...]
PCMA Thermal Interface for Intel Core LGA-115x Processors
Liquid cooling product manufacturer EK Water Blocks has released EK-TIM Indigo XS, a thermal interface material for Intel Core LGA-115x processors. Unlike greases, metallic thermal interface pads or liquid metal alloys, Indigo XS is a self-contained and sealed structure, deploying a phase-change metallic alloy (PCMA) which reflows and fills surface asperities on the CPU lid … [Read more...]
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