Dow Corning, a developer of silicon-based technology, has introduced new Dow Corning Dispensable Thermal Pads for use in LED, data server, telecommunications equipment and transportation thermal management applications. “Compared to traditional fabricated thermal pads, new Dow Corning Dispensable Thermal Pads offer the potential for broader design latitudes, simplified … [Read more...]
Thermal Facts & Fairy Tales: How Useful Are Heat Sink Correlations for Design Purposes?
Clemens J.M. Lasance Guest Editor, Philips Research Emeritus, Consultant at SomelikeitCool I assume everybody agrees with the fact that it is pointless to devote precious space in this magazine to highlight again all problems related to thermal management of electronic products and systems, so let’s start right away. An important way of reducing the temperature in an optimal … [Read more...]
Electronics Cooling December 2013 Issue Now Online
Don’t miss out on the December 2013 issue of Electronics Cooling, which includes feature articles on Energy-Efficient Warm-Water Cooling of Servers; Thermal Management of Many-core Processors using Power Multiplexing, Characterization of Server Thermal Mass; as well as a calculation corner and technical briefs. If you would like to receive your free copy of Electronics … [Read more...]
Thermoelectric Coolers for High Temperature Environments
Thermoelectric air conditioner supplier EIC Solutions has expanded its line of ThermoTEC thermoelectric coolers with the addition of a high ambient temperature model. Designed to cool electronic enclosures in extremely hot settings such as in deserts, or in high heat industrial applications such as those near blast furnaces, the new thermoelectric units are capable of … [Read more...]
Patent for Heat Spreader for IC Package, and IC Package Clamper Having the Heat Spreader
The U.S Patent and Trademark Office has awarded patent No. 8, 587,947, “Heat Spreader for IC Package, and IC Package Clamper Having the Heat Spreader” to Shinko Electric Industries Co., Ltd. of Japan. According to background information supplied by the inventors, “there are proposed various heat spreaders for spreading heat generated from an IC chip mounted on an IC … [Read more...]
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