U.S. Air Force officials have awarded multimillion dollar contracts to BAE Systems and Boeing Co. as part of DARPA’s Intrachip/Interchip Enhanced Cooling Applications (ICECool Applications) program. The ICECool program seeks to develop advanced electronics cooling techniques for high-performance embedded computer (HPEC) and RF monolithic microwave integrated circuit (MMIC) … [Read more...]
Electronics Packaging Technology Conference 2013
December 11-13, 2013 Singapore EPTC 2013 will feature technical sessions, short courses/forums, an exhibition, social and networking activities. It aims to provide a good coverage of technological developments in all areas of electronic packaging from design to manufacturing and operation. It is a major forum for the exchange of knowledge and provides opportunities to network … [Read more...]
New Surfaces Ease Dissipation of Extreme Heat
A new method of cooling extremely hot surfaces more effectively from researchers at MIT could benefit industrial equipment and electronic devices. Considered by many to be a quieter, more efficient way of removing heat compared to traditional air cooling methods, liquid cooling is commonly used in a number of applications such as internal combustion engines in vehicles and … [Read more...]
Sony Releases Source Code for Thermal Management Solution
Consumer electronics provider Sony has released the source code for Thermanager, a thermal management solution developed for and used in the company’s Android Open Source Project (AOSP) for Xperia projects. The source code is available through the Sony channel on GitHub. “Since the first release of Android Open Source Project (AOSP) for Xperia devices, thermal management for … [Read more...]
Webinar Question & Answer Session
Editor’s note: This question was asked in response to Electronics Cooling’s recent webinar by Carl Zwebin. To view the webinar, click here. Question: Are these graphite based materials compressible? Answer: In general, they are not compressible. However, exfoliated natural graphite is compressed during the manufacturing process used to make thermal interface materials and … [Read more...]
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