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Patent Covers Methods of Making, Cooling Semiconductor Packages

 

The U.S. Patent and Trademark Office has awarded patent No. 8,546,935, “Semiconductor Packages,” to Micron Technology, Inc. of Boise, Idaho. According to background information provider by the inventors, the patent covers “semiconductor packages having grooves within a semiconductor die backside, and includes semiconductor packages utilizing carbon nanostructures (such as, for … [Read more...]

New Patent Covers System for Clamping Heat Sink

 

The U.S. Patent and Trademark Office has assigned patent No. 8,546,192, “System for Clamping Heat Sink,” to Harman International Industries, Inc. in Stamford, Conn. According to the background information provided by the inventor, the patent covers “a system for clamping a heat sink that prevents excessive clamping force. The system may include a heat sink, a semiconductor … [Read more...]

Axial Fan Diffuser Increases Fan Aerodynamic Efficiency

 

Fan and blower manufacturer ebm papst has released the new AxiTop axial fan diffuser designed to help increase aerodynamic efficiency in fan systems. “The kinetic energy (velocity) at the exhaust of an axial impeller dissipates when the air is suddenly discharged into the surrounding environment,” the company explained. “The AxiTop diffuser is designed to recover this wasted … [Read more...]

New Low Viscosity, Thermally-Conductive Silicone Potting Elastomer

 

NuSil Technology, a manufacturer of silicone materials for the medical, aerospace, electronics and engineering markets, has released R-2165, a new silicone solution for the protection of electronic components and systems such as sensors, relays and connectors. “R-2165 is the latest addition to NuSil’s diverse portfolio of silicones designed for potting and encapsulating … [Read more...]

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