Temperature control specialist Oven Industries Inc. has released a new line of thermoelectric peltier coolers for use in a variety of temperature control applications. Ideal for usage in universities, science laboratories, PCR research and businesses that specialize in temperature control, the 5R6-900 peltier cooler features an easy-to-read digital display for controlling … [Read more...]
Testing of Power LEDs: The Latest Thermal Testing Standards from JEDEC
András Poppe, Ph.D.; Mentor Graphics MAD MicReD Unit The electrical, thermal and optical parameters determining light emitting didoes (LEDs) operation are in a strong, mutual dependence; without knowledge about the parameters in one of these domains the other characteristics cannot be measured correctly. The reliability, useful operating life time and luminous flux are … [Read more...]
Heat Pipe Integration Strategies for LED Applications
Dr. Richard Bonner, Anqi (Angie) Fan, Daniel Pounds and Dr. Ehsan Yakhshi-Tafti; Advanced Cooling Technologies, Inc. INTRODUCTION In light-emitting diodes (LEDs), 70 percent to 80 percent of the applied electrical power is converted to waste heat. If this thermal energy is not properly dissipated, the resulting high operating temperatures lead to reduced brightness, shift … [Read more...]
Thin Film Thermal Conductivity Measurement using a Micropipette Thermocouple
R. Shrestha, K. M. Lee and T. Y. Choi - University of North Texas D. S. Kim - POSTECH INTRODUCTION Due to the required experimental characterization complexity for the thermal conductivity measurement of thin films, accurate measurement of such materials has been difficult to achieve for thicknesses less than 1 µm. For example, conventional Fourier heater plate … [Read more...]
New Low Resistance TIM Delivers 6.0 W/m°K Thermal Conductivity
Thermal interface material provider Fujipoly has released Sarcon GR45A-00, a very low modulus thermal interface material with a low thermal resistance. Featuring a thermal conductivity of 6.0 W/m°K per ASTM D2326 (4.5 W/m°K per ISO/CD 22007-2 Hot disk) and a thermal resistance as low as 1.33°C cm2/W, the new formulation completely fills air gaps between components, board … [Read more...]
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