A new method for manufacturing high ratio air-cooled extruded aluminum heat sinks has been announced by Sapa Extrusions North America. Created by Sapa’s North American Technical Center (NATC), an internal research, design and development center, the new method combines the company’s aluminum extrusion manufacturing techniques with friction stir welding technology to create … [Read more...]
Fiber Optic Cable Heat Sensor Project Receives $1.5 Million Grant
A project to help data centers reduce their carbon footprint by using fiber optic cables as heat sensors has been awarded almost £1 million ($1,556,700 USD) in government funding. The investment, from the Department for Energy and Climate Change (DECC), will be used to help Cambridge-based start-up Alquist further develop its Celsius technology and test it at two London data … [Read more...]
Dielectric Heat Transfer Fluid Line Expanded
DSI Ventures, Inc., a developer of biodegradable lubricants and electrical insulating products, has announced the expansion of its OptiCool line of dielectric heat transfer fluids. Introduced in 2001, OptiCool fluids are made from synthetic paraffin hydrocarbons, and are used to cool and insulate computer services, high-torque DC motors, power electronics and avionics. “We … [Read more...]
Heat Exchanger Research Could Lead to Better Liquid Cooling in Aerospace, Automotive, Defense Applications
A New Mexico State University assistant professor is investigating methods of increasing heat exchanger efficiency that could enable space missions to remain in orbit for longer periods of time and lead to better automotive, defense, data center and power generation thermal management systems. “The problem we are addressing is how to extend NASA space missions,” Krishna Kota, … [Read more...]
New Multi-Tasking Robot Platform for Thermal Grease Dispensing Applications
Automated liquid dispensing equipment provider Fisnar has announced the release of a new multi-tasking robot designed to assist with safe and secure dispensing applications ranging from miniature SMT circuit boards to larger PCBs and finished assemblies. Ideal for precision form-in-place gaskets, encapsulation, coating, EMI and thermal grease applications, underfill and … [Read more...]
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