A new high temperature-resistant B-staged adhesive film is available from Master Bond for bonding and sealing applications in the aerospace, electronic, opto-electronic and specialty OEM industries. FLM36 film adhesive can withstand temperatures up to 500°F, offers good electrical insulation, and retains its high strength properties upon prolonged exposure to elevated … [Read more...]
Thermal Pads Enhance LED/Luminaire Performance
Silicon-based technology developer Dow Corning has released new dispensable thermal pads for more cost-effective thermal management in LED lighting applications. The new dispensable thermal pads “enable LED lamp and luminaire manufacturers to quickly and precisely print a layer of thermally conductive silicone compound in controllable thicknesses on complex substrate shapes … [Read more...]
NASA Astronaut Releases Video on Helmet Leak
Several weeks after NASA aborted a spacewalk outside the International Space Station following a report of a water leak inside Italian astronaut Luca Parmitano’s helmet, Parmitano’s spacewalk partner has released a two-part video explaining the origin of the leak. The July 16 spacewalk was aborted approximately an hour-and-a-half into what was to be a six-hour spacewalk to … [Read more...]
High Temperature Capacitors Could Remove Need for EV Cooling Systems
A new lead-free, high temperature ceramic capacitor developed by scientists at the National Physical Laboratory (NPL), UK could improve the efficiency and reliability of electric and hybrid vehicles by enabling the removal of heavy complex cooling systems. “Electric vehicle operating temperatures can go up to 140°C [almost double the temperature conventional capacitors can … [Read more...]
Thermal Adhesive Tape for Application to Unprocessed PCBs
Thermal management materials manufacturer Universal Science has introduced a new thermal adhesive tape designed to be applied to FR4 or insulated metal substrate printed circuit boards (PCBs) prior to processing as a replacement for mechanical fixings. Featuring a thermal conductivity of 2.0 W/mK and a breakdown voltage (electrical isolation) of 4 kV AC, Bondline 2000-REFLOW … [Read more...]
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