July 14-19, 2013 Minneapolis, Minnesota “This conference will bring together international researchers and engineers focusing on heat and mass transfer in a variety of applications. The objectives of the meeting are to provide a forum for presentation of state-of-the-art research and opportunities for technical interactions among participants. The conference will also … [Read more...]
Thermally Conductive Material Could Replace Diamond in Electronic Devices
Researchers claim to have identified a material with extraordinarily high thermal conductivity that could replace diamond as an effective thermal management material and lower the manufacturing costs of electronic devices. Considered one of the best thermal conductors in the industry, with a room-temperature thermal conductivity of more than 2,000 watts per meter per … [Read more...]
Thermally Conductive Acrylic Interface Pads
Electronic component distributor Digi-Key has announced the availability of 3M’s 5590H series thermally-conductive acrylic interface pads for effective heat transfer and vibration dampining in demanding thermal applications. According to the company, the new 5590H series is ideal for cooling high intensity LEDs and bonding heat sinks, heat spreaders and other cooling devices to … [Read more...]
Graphene Heat Spreader Reduces Hotspot Temperatures
Use of a graphene in silicon-based electronics could help increase energy efficiency by significantly reducing hotspot temperatures inside processors, an international team of researchers has claimed. Modern electronics systems generate a large amount of heat, due in part to the increasing demand for smaller, more powerful devices. While traditional cooling methods have … [Read more...]
Gap Filler Thermal Interface Material for Silicone-Sensitive Electronic Applications
The Bergquist Company, a supplier of thermal management materials, has released Gap Filler 1500LV, a new “low volatility, two-component, liquid-dispensable thermal interface material that offers the high temperature resistance and low modulus of a silicone material with minimal outgassing.” According to the company, the new gap filler is ideal for use with fragile components … [Read more...]
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